TDC has collaborated with Yuta Hayakawa creating modern art.
This activity has been featured on newspaper Nikkan kogyo Shimbun.
TDC developed only-one technology of polishing thin foil in long length.
This technology has been used for mold for graphene growth process, hydrogen filter, substrate for flexible devices and so on.
I have never anticipated the usage of art work until this time. I feel it is a kind of serendipity.
We polished stainless foil shiny, but it seems like transparent by effect of angle and magic of the artist.
TDC is going give an invited lecture at Workshop for “Upshift in the Soft X-ray science of Synchrotron radiation”.
It will be held at the institute of solid state physics the University of Tokyo during 30/NOV – 1/DEC
TDC was appeared on feature article about SLiT-J project.
SLiT-J is a synchrotron facility which is going to be built in Miyagi pref.
for more about SLiT-J please ->http://www.slitj.tagen.tohoku.ac.jp/oldHP/about.html
TDC is starting new R&D project regarding planarizing and smoothing technology of new material in collaboration with Osaka university and AIST.
This project is granted by JST. (Japan science and technology agency)
TDC started new R&D project regarding MEMS technology in collaboration with laboratory of prof. Shuji Tanaka, Tohoku University.
This project is granted by METI (Ministry of economy, trade and industry).
TDC was introduced on feature article of Nikkei newspaper named “Company with very Good technology” on 31 Oct 2017.
you can magnify picture with click on the image.
TDC award our staff regularly and it is so called TDC innovation award.
2 of our staff were commended for their remarkable improvement of polishing technology.
It is internal event of our company. but it is joyful occurrence of us all in TDC.
So I’m happy to release this news here.
Please visit TDC at M-TECH. 21-23/June.
for more info—>http://mirror-polish.com/en/new/2786/
TDC is going to give a short lecture about alliance with CIES (center of integrated electronics systems)
We have developed new technology and products for the engineers in semiconductor industry.
I’m going to introduce abou way of our development at the seminar presented by Miyagi pref. and Tohoku univ.
TDC is developing new technology as collaboration with Kurihara lab from Tohoku university.
Kurihara lab is a core member of “Tohoku innovative material technology initiative for reconstruction” and they are focusing on Ultra-low friction technology area.
The academic approach eg; surface chemistry and nano-surface friction analyzing accelerated TDC to achieve super smooth roughness (sub-angstrom Ra) on SiC wafers.
We got very successful result from this work frame and I’m going to introduce our newly developed technology at the poster session of the symposium on 19 Jan.
For more info, please find at the website–>http://www.tohoku-timt.net/english/index.html