TDC is starting new R&D project regarding planarizing and smoothing technology of new material in collaboration with Osaka university and AIST.
This project is granted by JST. (Japan science and technology agency)
https://www.jst.go.jp/EN/index.html
Author Profile
-
CEO of TDC corporation.
Please ask me anytime about Polishing/Lapping, Grinding and Cutting.
Hometown: Sendai Miyagi Japan
Latest entries
Blog2021.01.05Happy new year!- Blog2020.12.25Happy holidays!
- Blog2020.12.07Welcome back home HAYABUSA2 !
- Blog2020.11.19Presicion polishing technology of Diamond wafers
