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Presicion polishing technology of Diamond wafers

Group of Osaka univ, AIST and TDC are now developing precision polishing technology of Single/Poly crystalline diamond wafers under the support of JST.
The article of our research was published in Scientific reports.
Diamond is the hardest known substance and essentially does not react with chemicals. Polishing it with a similarly hard tool damages the surface and conventional polishing chemistry is slow.
The significant feature of our newly developing technology is efficient(high speed) and damage free (low stress and less scratch marks) .

Author Profile

CEO of TDC corporation.
Please ask me anytime about Polishing/Lapping, Grinding and Cutting.

Hometown: Sendai Miyagi Japan
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