Precision Polishing of Diamond Semiconductors and Wafers

Diamond semiconductors, which are being developed for practical use as next-generation power semiconductors, have outstanding properties that surpass those of other power semiconductors like SiC (silicon carbide) and GaN (gallium nitride). While synthetic diamond, the material used in these semiconductors, possesses exceptional characteristics, it is also known for its very high hardness and brittleness, making it a difficult material to process.

At TDC, we offer contract polishing services for diamond wafers used in devices such as diamond semiconductors, and we have handled numerous requests to date.

In 2020, we conducted joint research with Osaka University and the National Institute of Advanced Industrial Science and Technology (AIST) to establish a plasma-assisted polishing method for diamond. Since then, we have continued to advance our research and are working on the development of new processing techniques.

Features of TDC’s Diamond Polishing

① Support for Large-Area Diamonds up to 70mm Square

TDC is equipped with facilities capable of handling large-area and large-diameter substrates.
While the typical size for diamond polishing is around 10mm square, as of 2024, we are able to perform precision polishing on diamond wafers up to 70mm square.

② Achieving Sub-Nanometer Surface Roughness

Building on years of expertise in ultra-precision processing and polishing for advanced fields, we have achieved high levels of smoothness on synthetic diamond, which is known for its extremely high hardness.

• For single crystals: Achieving surface roughness of Sa 0.3 nanometers or less
• For polycrystals: Achieving surface roughness of Sa 10 nanometers or less

The following chart shows an example of the surface roughness data for a single-crystal diamond polishing result.
For more details, please feel free to contact us.

③ Achieving High Flatness (Planarity)

At TDC, we are equipped with ultra-precision measurement devices that allow us to manage and control flatness (planarity).
When using diamond as a semiconductor substrate, we ensure high smoothness, flatness, and cleanliness, making it suitable not only for diamond but also for bonding with other materials such as SiC and GaN.

Additionally, we offer the essential “cleaning” process required in semiconductor manufacturing. From polishing to precision cleaning, we provide a comprehensive service for your needs.

For more information about TDC’s precision cleaning, please refer to the following page:
>>Precision Cleaning

For Precision Diamond Processing, Contact TDC

At TDC, we apply specialized processing know-how tailored to each material, along with the advanced techniques we have accumulated over the years, to process diamonds with high precision.
If you have any challenges related to diamond wafers or semiconductor manufacturing, please don’t hesitate to contact TDC for expert consultation.

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