JP
81-22-356-3131
+81-22-356-3131
  • TOP
  • Difficult-to-machine-material

タグ：Difficult-to-machine-material

diamond-wafer

Precision Polishing of Diamond Semiconductors and Wafers

Diamond semiconductors, which are being deve…
Difficult-to-machine-materialExample of processingR&DSemiconductor

Inconel: Properties, Uses and Processing Examples

This page explains the characteristics and a…
Difficult-to-machine-materialMetal
難削材_チタン

Difficult-to-Machine Materials: Basic Knowledge and Types

This page explains the basic knowledge, type…
Difficult-to-machine-material
タングステン

Tungsten: Properties, Uses and Processing Examples

On this page, we will explain the characteri…
Difficult-to-machine-materialMetalMinor Metal
ガラスの精密加工

Precision processing of crystal materials and glasses

This page introduces the precision processin…
Difficult-to-machine-material
サファイア鏡面基板

Sapphire: Properties, Uses and Processing Examples

This page introduces the sapphire polishing …
Difficult-to-machine-material

Polishing of plastic/acrylic resin

This page introduces the plastic/acrylic res…
Difficult-to-machine-materialResin
ステンレス　板厚

Plate thickness and material of stainless steel plate (SUS)

On this page, we will explain the thickness …
Difficult-to-machine-materialMetalStainless
インバー材

Invar/Super Invar: Properties, Uses and Processing Examples

This page explains the features and applicat…
Difficult-to-machine-materialMetalSemiconductor