TDC has established the world’s highest level of technology in the fields of ultra-precision lapping and polishing through the development of proprietary technologies and the accumulation of know-how. We offer not only polishing but also CMP, grinding, wafer thinning, wafer bonding and wafer cleaning services for variety of materials including Diamond, SiC, Si, GaN.
Our technology realizes high precision quality such as surface roughness Ra 1nm, parallelism 100 nm, flatness 30 nm, size tolerance +/-100 nm, angle +/- 3 sec, and roundness 50 nm. Combining these requirements, we can fabricate precise components.
In our precision manufacturing, it is essential to guarantee product quality with reliable inspection tools. We guarantee each requirement such as roughness, flatness with world renowned machined such as Bruker’s AFM, Zygo’s Aperture System and Optical surface profiler.
We handle wide range of materials such as diamond, metals resins, ceramics, glass, semiconductor and crystalline materials. We also polish not only flat surfaces, but also curved surfaces, spherical surfaces, inner and outer diameters, and can accommodate any shape required by our customers.
There is no better polishing shop in the world!
Feel free to contact us for any inquires.
Highly polished roll for Nano-imprinting mold.
With our own unique technology, we have achieved surface roughness of Ra1nm for long foils exceeding 100 meters.
Our diamond polishing realize the surface roughness of Sa0.2nm and the flatness of 0.5 um. We can polish the samples up to 40mm right now.
TDC’s super precision shims, spacers, washers without dispersion in thickness lead to high assembly precision and realize the reproducibility and reliability of assembly. They reduce looseness even after long-term use. We make shims for M2 to M8 as TDC standard shim.
There is no better polishing shop in the world!
Feel free to contact us for any inquires.
