We are joining LTB-3D 2026 (May 13-15, 2026)
Thank you very much for your continued support.
We are pleased to announce that TDC will be exhibiting at LTB-3D 2026 (The 9th International Workshop on Low Temperature Bonding for 3D Integration), held in Kanazawa, Ishikawa.
LTB-3D 2026 LTB-3D is a premier international forum focused on “Low Temperature Bonding,” a technology essential for next-generation semiconductor integration, including 3D stacking and heterogeneous integration. This workshop serves as a vital platform where researchers and engineers from around the globe gather to discuss the fundamental technologies supporting 21st-century device structures—ranging from Surface Activated Bonding (SAB) and Atomic Diffusion Bonding (ADB) to the latest hybrid bonding techniques.
At the TDC booth, we will showcase our technologies and products that contribute to these cutting-edge fields. Our expert staff will be available throughout the event, so please feel free to stop by for technical consultations or to exchange information on the latest industry trends.
We look forward to welcoming you to our booth.
| Date |
May 13-15, 2026 |
| Venue | Kanazawa Bunka Hall (Kanazawa, Japan) |
| Website | https://imsi.jp/ltb3d//ltb3d-2026/index.html |
| Attending Staff |
CEO Yuko Akabane Sales rep. Chisato Maeda |
TDC Information
