Ultra-Precision Polishing and Machining Services
Contents
Ultra-Precision Polishing and Machining That Achieves the Ra1 Nanometer Level
At TDC, we work in the field known as ultra-precision polishing and machining, led by mirror finishing. By pursuing techniques specific to this field, we achieve surface roughness at the Ra1 nanometer level.
One nanometer is one-billionth of a meter—a vanishingly small world, roughly one hundred-thousandth the thickness of a human hair. Naturally, nothing on that scale can be judged by eye, so we keep a range of high-precision measuring instruments in house that can put numbers to it, and by repeating the polishing and measurement processes, we keep working to raise quality further.
In TDC’s ultra-precision polishing work, we use lapping machines, polishing machines, and surface grinders, along with dedicated equipment and tooling we developed ourselves. This lets us hold two or more geometric and dimensional specifications—flatness, parallelism, dimensional tolerance, surface roughness, squareness, and others—simultaneously, to nanometer precision.
To date we have received a great many requests from areas where ultimate precision is required, such as improving the flatness and parallelism of precision stages and tables used in semiconductor manufacturing equipment, optical components, and precision measuring instruments.
For more on our track record, please visit our Case Studies and Machining Examples pages.
We Handle Any Material, Any Shape
TDC’s key strength is that we can perform ultra-precision polishing regardless of material or shape, with finishes as fine as sub-nanometer Ra. We have built an extensive track record not just in metals but in ceramics, glass, resins, stone surface plates, and more—the full range, difficult-to-machine materials included.
Whatever the field, we can help—semiconductors, advanced medical technology, measuring instruments, machine tools, and more. In addition, we work with research institutions and on works of art, applying our world-class ultra-precision polishing.
In recent years, TDC’s nanotechnology has gone into aerospace and space research and development where the demands on precision and quality are extreme: NASA’s Balloon Project, the BICEP3 Telescope observing the cosmic microwave background (CMB) from Antarctica, and JAXA’s Hayabusa2, which landed on the near-Earth asteroid Ryugu.
TDC’s Ultra-Precision Polishing and Machining
Services for Semiconductors and Ultra-Precision Components
At TDC, we help customers solve their precision machining challenges through ultra-high-precision polishing, cutting, and grinding. We also offer precision cleaning and precision measurement—services that are essential in the machining of semiconductors and ultra-precision components.
We take on more than individual processes: we can handle the upstream and downstream steps as well. Whatever you have in mind, please feel free to get in touch.
Our Services
- Polishing – lapping, CMP (chemical mechanical polishing), surface grinding / polishing, cylindrical grinding / polishing, buffing, electropolishing, chemical polishing
- Turning and milling
- Cutting – laser cutting, waterjet cutting
- Plating, anodizing, DLC coating, black oxide finishing, Raydent treatment, heat treatment
- Abrasive blasting
- Precision sheet metal fabrication
- Press working
- Joining
- Mechanical engraving, laser marking
- Electrical discharge machining (EDM)
- Precision cleaning
- Precision measurement
(Including work handled by our partner companies)
TDC Information
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