ポリッシング研磨加工

What is polishing?

Here is the basic knowledge of polishing.

What is polishing?

Polishing is the one of the ways to make the surface smooth. It is the processing to give gloss to the product and usually adopted as the final process of machining processing. Diamond polishing is also famous for its method using diamond abrasive grains called slurry.

TDC’s polishing

In TDC’s precision polishing and ultra-precision polishing, in addition to lap polishing, polishing is also incorporated depending on the precision and processing purpose.

We will select the most suitable processing method according to the customer’s needs. Our polishing not only gives the surface roughness and luster, but also realizes ultra-precision accuracy by removing a very small amount. Please feel free to contact us as we can respond to ultra-high precision requests.

Feel free to contact us for any inquires.

Polishing method / processing principle

Polishing is a delicate method that requires higher accuracy than lapping.
Construction methods include mechanical polishing and chemical mechanical polishing (CMP). Since the product is polished using fine abrasive grains and soft pads, it is characterized by being able to perform mirror processing without generating scratches, cracks, or alteration layers.

There is also what is called diamond polish, which uses diamond abrasive grains to achieve both processing efficiency (removal speed) and surface roughness.

By the way, it may be necessary to note that the word polishing in the field of optics may mean polishing the surface and finishing / cleaning.

What is the difference between polishing and CMP?

CMP processing refers to chemical polishing
The difference from general polishing is that while using a processing liquid to chemically dissolve the surface of the product, mechanical polishing with abrasive grains such as silica and zirconia is performed at the same time to obtain a smoother polished surface.
A synergistic effect is obtained from the combined action, which improves the speed and quality of polishing. It is also used for flattening the surface of semiconductor wafers because it has extremely low distortion during processing.

What is CMP

TDC is the best for Polishing

It is a processing method that requires high technology because it uses construction methods such as mechanical polishing and chemical mechanical polishing (CMP). Therefore, if you are not familiar with the construction method, you may not be able to perform optimal processing for the product.

TDC can deliver products according to your desired delivery date, and has accumulated unique technological development and know-how in processing, making it possible to handle any shape.
Please feel free to contact us for any inquiries regarding processing or basic concerns.

Feel free to contact us for any inquires.

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