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Precision Lapping Service
Precision Lapping Service
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Lapping
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CMP
Cylindrical Grinding / Polishing
Mirror Finishing / Mirror Polishing
Cutting Service
Grinding Service
Precision Cleaning Service
Wafer Cleaning Equipment
Semiconductor Wafer Cleaning
Ultrapure Water Cleaning
Precision Measurement Service
Bruker “Dimension Icon”
Talysurf
Talyrond
Optical Nano Gauge
Mitutoyo measuring instrument used in TDC
KEYENCE measuring instruments used at TDC
TDC’s Surface Roughness Achievements
Download Catalog
Case Studies
Processing Examples
Technology
Technology
Spacer / Shim
Super Mirror-Polished Roll / Shaft
Super Precision Long Foil Polishing
Maintenance of Surface Plate
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Equipment & Quality
Processing Equipment
Measurement Equipment
Quality Assurance
FAQ
FAQ
Q&A
What is Surface Roughness
Basic Knowledge of Polishing
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Semiconductor
タグ：Semiconductor
Precision Polishing of Diamond Semiconductors and Wafers
Diamond semiconductors, which are being deve…
Difficult-to-machine-material
Example of processing
R&D
Semiconductor
Ggallium Nitride (GaN): Properties, Uses and Processing Examples
This page explains the characteristics, appl…
Semiconductor
Chuck Table: Basic information, Types, Processing at TDC
This page provides an overview of chuck tabl…
Example of processing
Semiconductor
Tantalum: Properties, Uses and Processing Examples
On this page, we will explain the characteri…
Metal
Minor Metal
Semiconductor
Glassy Carbon: Properties, Uses and Processing Examples
This page introduces precision processing of…
Carbon
Semiconductor
Invar/Super Invar: Properties, Uses and Processing Examples
This page explains the features and applicat…
Difficult-to-machine-material
Metal
Semiconductor
SiC: Properties, Uses and Processing Examples
This page introduces the SiC polishing proce…
Difficult-to-machine-material
Semiconductor
Semiconductor Wafer Cleaning
This page explains "semiconductor cleaning,"…
Precision Cleaning
Semiconductor
Ultrapure Water Cleaning
This page provides an explanation of ultrapu…
Precision Cleaning
Semiconductor
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